CLCC packaging（ceramic leadedchip carrier）

    CLCC packaging , one of the smt packaging, is also called QFJ, QFJ-G packaging.

    The position of CLCC-type packaging has become more and more prominent in military equipment, various modern communication system equipment, and electronic instruments.

   With more than ten years of rich professional technology, strong production technology and R&D capabilities, our company has laid a solid foundation in the field of component forming.

    In September 2021, a new technological breakthrough was achieved—CLCC forming. This technology uses a smooth and simple operation process to form the unformed CLCC package into a J-shape. The formed package has high precision, good consistency, and no indentation damage to the leads.

    Components lead forming machine of our company has concise appearance and excellent capability, it is suit for small batches and mass varieties production. The series of products are used in QFP, SOP, THT, CLCC and other components and able to meet customer’s needs. Adhering to the concept of making world-class products, our company will continue to innovate and wholeheartedly help customers meet the challenges of the semiconductor industry.