After painstaking reaserch of R&D team, we has grandly launched a new vapor degreaser cleaning equipment---Vapor SUI Clean. Compared with tranditional ultrasonic vapor cleaning machine, this is a new attempt on the field of solvent ultrasonic wave cleaning. Vapor SUI Clean adopts the unique cleaning technology to reduce consumption of solvent and achieve excellent cleaning effect.
Cleaning Application:
Cleaning after die bond
Cleaning of 3D package
Micro-standoff precisely cleaning
SIP and microwave assembly cleaning
Cleaning before chip packaging
Cleaning before PCBA coating
Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF;
Apply for assemblies of water-free cleaning
Factory which doesn’t permit wastewater discharge.
Unique Advantage:
Unique double flow cleaning technology ---- “SUI”,which with high flow spray under immersion sump up to 500L/min.
Spray under immersion+bubbling+vertically oscillated of basket, even no ultrasonic to achieve perfect cleaning result.(132Hz ultrasonic cleaning optional)
Waterfree cleaning process is apply for cleaning after die bond,which can rinse the organics thoroughly.
Multi-cycles vapor rinse to improve flexibility of cleaning process.
Double refrigeration system+ Double-seal technology, strictly control the volatilization of solvent, no harm to operator and environment friendly.
Cleaning process can be set flexibly according to cleaning application.
Wide range of customized basket and fixture.
