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Semi-automatic Forming System SAPFL
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Equipped with an adjustable double-sided mold, able to form all leads of flat packaged chips, including top lead chip, middle lead chip, and bottom lead chip (the center positioning block is needed). High-precision forming is achieved through adjustable relevant parameters. Lead forming and cutting are completed at one time. Various sizes of flat packaged chips can be processed according to customer needs, as well as products with different lead lengths (with different specific molds) and forming height. The equipment adjusts the body width and shoulder height through PC control. Components are manually placed and removed, completing all leading and cutting works. The equipment is featured with convenient operation and wide application, it is ideal for high-mix low-volume production.

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major function Equipment features
major function

  • Double side forming: realizing simultaneous forming and cutting at one time of both sides.
  • The standoff height (A+J) can be set via computer and automatically adjusted by the system.
  • The chip size to be formed can be set on the computer and automatically adjusted via closed loop of stepping motor and magnetic ruler on mold.
  • PC control, multiple sets of data can be saved.
  • The dwell time can be set to reduce the rebound rate of the lead after formed.
  • USB communication interface, the data in the whole process can be monitored and saved by computer.

Equipment features


  • An adjustable double-side mold is equipped to form different sizes of QFP and SOP.
  • The equipment provides driving pressure through a precise pneumatic press.
  • Absorb the chip with a vacuum adsorption device, pick and place the molded chip via a manual mechanical arm.
  • The high-precision lead cutting fully meets the welding process requirements of flat packaged chip. End face burr ≤ 0.05mm.
  • After forming, the coplanarity of the leads is less than 0.08mm, the form and size of the leads in each side are symmetric.
  • The gold-plated surface of the lead will be slightly scratched after forming, but not damaged. There will be no indentation, crack or pit on the lead.


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