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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Parylene Coating System Heating Plate Series Component Tinning Equipment Other Equipment
Your position : Product Center Cleaning Equipment For Electronic Assembly Micro Assembly Cleaning
Cleaning machine Hydro-clean LTS-Plus
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Remove flux or moderately soluble solder residue from PCB boards

Remove fingerprint contamination during PCB manufacturing

Remove FOD

Cleaning misprints with complex components

Clean before coating

Clean the tray

Remove oil contamination from mechanical components



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Cleaning applications Equipment features
Cleaning applications
  • Remove flux or moderately soluble solder residue from PCB boards
  • Removing Handprint Pollution in PCB Manufacturing
  • Remove FOD
  • Cleaning misprints with complex components
  • Cleaning before coating
  • Cleaning tray
  • Remove oil contamination from mechanical components


Equipment features
  • Spray in air, closed-loop system, zero discharge system
  • Large capacity, mass cleaning
  • Double layer PCBA fixtures
  • Nozzle arm move from left and right
  • Strong heating and drying
  • Compatible with various chemical media
  • Spray in air with no shadows
  • Double rinse optional
  • Visual window for observing cleaning process
  • Multiple standard and customized PCBA fixtures
  • Up to 3 completely independent liquid closed-loop pipelines can be configured
  • High liquid utilization rate
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