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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Parylene Coating System Heating Plate Series Component Tinning Equipment Other Equipment
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Split-type heating plate
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It is mainly composed of heating table, temperature controller, etc. the split structure can make the heating table easy to move. It is mainly applied to the welding of chip and substrate, substrate and shell in the packaging and assembly process of microelectronics such as hybrid circuits and optical fiber devices.

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Technical Parameter Equipment features
Technical Parameter
Equipment features
  • The temperature can be set and continuously adjustable.
  • The working area is a square worktable with large effective heating area.
  • The equipment frame is provided with thermal insulation protection to avoid scalding.
  • The overall structure layout design is reasonable, the operation is simple, and the maintenance is convenient.
  • Independent temperature control is adopted for temperature control to ensure the welding process.
  • The temperature distribution of the heating table is uniform.
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