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Heating plate
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Heating plate series is apply to weld between component and substrate ,substrate and shell in process of microelectronics packaging and assembly such as: hybrid circuit、optical fiber electronic device.
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Technical Parameter Equipment features
Technical Parameter
  • Square worktable can make sure widely effective heating area. 
  • Independent temperature control to ensure the welding process. 
  • Adjustable temperature can be set. 
  • Uniform temperature distribution of heating table.
  • Equipment frame with heat insulation protection, avoid scalding. 
  • Reasonable structure is easy to operate and maintain. 
Equipment features
  • Square worktable can make sure widely effective heating area. 
  • Independent temperature control to ensure the welding process. 
  • Adjustable temperature can be set. 
  • Uniform temperature distribution of heating table.
  • Equipment frame with heat insulation protection, avoid scalding. 
  • Reasonable structure is easy to operate and maintain.


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