On July 23, Purbest made in the CEIA Summit Forum,and gathered with many industry experts and well-known enterprises at home and abroad! The situation is particularly difficult under the epidemic situation, and this gathering makes people feel precious.
Intelligent manufacturing VS Ancient capital of Six Dynasties
Focus on the latest industry development trend
Promote military electronic innovation
As an exhibition enterprise,Purbest has brought our latest products, and visitors in front of the exhibition stand are in an endless stream.
Review of exhibits
Cleaning machine for electronic assembly Hydro-clean LDS
Cleaning application:
Removing all kinds of solder residues
Cleaning of micromechanical components
Cleaning contamination from handling and board manufacturing, removing FOD
Cleaning highly populated electronic assemblies with low standoff such as BGA,CSP.BTC,QFN,MELF
Cleaning of power electronics
Electronic assemblies requiring extra short process time
Second side misprints on complex assemblies
Cleaning before conformal coating and wire bonding
Unique advantages:
Fully automatic spray-in-air closed loop zero drain system
Triple capacity configuration
Linear direct spray for equal washing of entire surface
100% filtration of entire spray volume
Optional triple rinse
Hot air knife direct dry technology
Window for visual process control
All process steps with up to 5 substeps for highest flexibility
Wide range of standard and customized PCBA fixtures
Clamping for all types of stencils
Up to 3 fully separated liquid loops
Low consumption of chemicals and water
Proportional level sensors in all processes
Outstanding options of water utilization
Automatic Forming
System - APFL
Automatic forming system (APFL), adopting a precision servo-electric press and an adjustable double-sided mold, can form all kinds of flat packages(top lead chip, middle lead chip and bottom lead chip).
Components tinning system
Super Tinning is for THT and SMT component tinning and re-tinning applications. The system can automatically handle common and exotic components and connectors, including， but not limited to：QFP，flatpack, axial, discrete, BGA，PLCC，CLCC，DIP，SIP，capacitors, resistor and inductor components. The system can be configured with 8 possible stations: automatic loading and unloading station, visual positioning and detection station, flux station, preheat station, THT alloy removal station、THT tinning station、SMT alloy removal station、SMT tinning station.
