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Equipment solutions for cleaning, lead forming, and microelectronics assembly
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Manual Wedge Bonder M60W
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M60W is mainly used for wedge bonding of hybrid circuits, MCM multichip modules, optical devices, microwave devices, laser devices, and discrete devices. It is equipped with a height-adjustable workbench, suitable for various types of wire bonding such as aluminum wire, gold wire, and gold ribbon. It can export bonding programs to flash disks for storage, with ample storage space.






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Equipmeng Features
Equipmeng Features


  • WINDOWS system, easy to operate
  • Optional adaptive microscope system
  • Deep access bonding capability
  • X, Y, Z operating lever, flexible operation, convenient for bonding at different heights
  • Compatible with wire diameters: Gold wire: 17-75 μm, Aluminum wire: 20-76 μm, Gold ribbon: Up to 25×250 μm

Why M60W


M60W is suitable for users who need a manual wedge bonder with flexible application coverage rather than a machine dedicated to only one device type. Its main advantage is that it can handle a wide range of bonding applications, from hybrid circuits to optical and microwave devices, while still offering flexible manual control for different bonding heights and access conditions. For users who need practical operation, broad material compatibility, and easy program storage, M60W is a reliable bonding solution.




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