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Your position : Products Lead Forming Equipment Semi-Automatic Lead Forming Equipment
Semi-Automatic Forming System - SAPFL
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SAPFL is a semi-automatic forming system designed for flat packaged chips, including top lead, middle lead, and bottom lead types. It adopts a precise pneumatic press and an adjustable double-sided mold, allowing lead forming and cutting to be completed at one time. The equipment adjusts body width and shoulder height through PC control, while parts are manually loaded and unloaded for practical shop-floor operation. It is particularly suitable for high-mix low-volume production. 


The system can process various sizes of flat packaged chips according to production needs, and different lead lengths and forming heights can also be handled with specific molds. With its computer-controlled adjustment and flexible mold structure, SAPFL is suitable for users who need one machine to cover multiple package types and parameter settings.  




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Main Functions Equipment Features
Main Functions


  • Double side forming: realizing simultaneous forming and cutting at one time of both sides.
  • The standoff height (A+J) can be set via computer and automatically adjusted by the system.
  • The chip size to be formed can be set on the computer and automatically adjusted via closed loop of stepping motor and magnetic ruler on mold.
  • PC control, multiple sets of data can be saved.
  • The dwell time can be set to reduce the rebound rate of the lead after formed.
  • USB communication interface, the data in the whole process can be monitored and saved by computer.


Equipment Features


  • An adjustable double-side mold is equipped to form different sizes of QFP and SOP.
  • The equipment provides driving pressure through a precise pneumatic press.
  • Absorb the chip with a vacuum adsorption device, pick and place the molded chip via a manual mechanical arm.
  • The high-precision lead cutting fully meets the welding process requirements of flat packaged chip. End face burr ≤ 0.05mm.
  • After forming, the coplanarity of the leads is less than 0.08mm, the form and size of the leads in each side are symmetric.
  • The gold-plated surface of the lead will be slightly scratched after forming, but not damaged. There will be no indentation, crack or pit on the lead.


Why SAPFL


SAPFL is suitable for users who need a forming system that offers more flexibility than fixed-mold or purely pneumatic manual setups. Its main advantage is the combination of semi-automatic operation and computer-controlled parameter adjustment, which makes it practical for frequent product changes and different package sizes. For production involving QFP, SOP, and other flat packaged chips in smaller mixed batches, SAPFL provides a good balance of flexibility, forming accuracy, and traceable process control. 


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