En
中文 Ru
Products
Equipment solutions for cleaning, lead forming, and microelectronics assembly
Scroll down
Your position : Products Electronic Assembly Cleaning Equipment Microelectronics Cleaning
Vapor Phase Cleaning Machine – Vapor SUI 2
Profile：

Vapor SUI 2 is a vapor phase cleaning machine developed for precision cleaning of electronic assemblies and sensitive components. It is especially suitable for applications that require water-free cleaning, including bare chips, 3D packaging components, and assemblies with micro gaps or low stand-off structures.


Scroll down
Cleaning Applications Equipment Features
Cleaning Applications

Vapor SUI 2 is suitable for semiconductor packaging, microwave component cleaning, pre-packaging cleaning, and cleaning before PCBA coating. It can also be used for components and assemblies that are difficult to clean with conventional aqueous processes.


Typical application include:

  • Bare chip cleaning
  • Cleaning of 3D packaging components
  • Micro gap ultra precision cleaning
  • SIP and microwave component cleaning
  • Cleaning before semiconductor packaging
  • Cleaning before PCBA coating
  • Clean of low stand-off components, such as FC, BGA, CSP, BTC, QFN, MELF, etc
  • Application requiring water-free cleaning
  • Factory where wastewater discharge is restricted
Equipment Features

Vapor SUI 2 adopts a vapor phase cleaning process and features spray-under-immersion technology combined with double-flow cleaning technology. It supports multiple cleaning actions, including spray under immersion, basket oscillation, helping achieve effective cleaning performance without relying on ultrasonic cleaning. Optional 132 kHz ultrasonic cleaning is also available.


The machine supports multiple cycles of vapor rinsing, allowing higher process flexibility for different cleaning requirements. Its dual condensation system and dual sealing design help control solvent volatilization and reduce solvent loss during operation.


  • Unique spray under immersion technology, double flow cleaning technology, up to 300L/min 
  • Spray under immersion+Basket oscillation, achieving ideal cleaning effect without ultrasonic (132kHz ultrasonic is optional)
  • Water free cleaning process, suitable for bare chip cleaning, capable of rinsing clean organics
  • Multiple cycles of vapor rinsing to improve process flexibility
  • Dual condensation system+dual sealing, strictly control solvent volatilization, user-friendly
  • The cleaning process can be flexibly set according to the cleaning requirment
  • Customized baskets and fixtures

Why Vapor SUI 2


Compared with conventional cleaning processes, Vapor SUI 2 is more suitable for components with narrow gaps, complex geometries, and low stand-off structures. The water-free process makes it especially useful for applications where moisture sensitivity, wastewater discharge, or solvent management is a concern.


TOP