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Co-Solvent Vapor Phase Cleaning Machine – Vapor SUI Mini 3
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Vapor SUI Mini 3 is a compact co-solvent vapor phase cleaning machine designed for precision cleaning of sensitive electronic components and complex assemblies. It is especially suitable for micro gap cleaning, precision flux removal, and applications that require a water-free cleaning process.

Compared with single-solvent configurations, Vapor SUI Mini 3 supports co-solvent cleaning for more flexible process capability. It is suitable for semiconductor packaging, precision electronic components, and other applications where stable cleaning performance and low residue are required.
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Cleaning Applications Equipment Features
Cleaning Applications


• Bare chip cleaning
• Cleaning of 3D packaging components
• Micro-gap ultra-precision cleaning
• SIP and microwave component cleaning
• Cleaning before semiconductor packaging
• Cleaning before PCBA coating
• Cleaning of components after lead tinning
• Cleaning of low stand-off electronic components, such as FC, BGA, CSP, BTC, QFN, and MELF
• Components that require water-free cleaning
• Factories where wastewater discharge is not allowed

Equipment Features
• Third-generation co-solvent cleaning solution
• Compact vapor phase cleaning system for precision components and micro assemblies
• Unique spray-under-immersion technology with double-flow cleaning, up to 300 L/min
• Spray under immersion, bubble cleaning, and basket oscillation combined for effective cleaning without ultrasonic; 132 kHz ultrasonic is optional
• Water-free cleaning process suitable for bare chip cleaning and capable of removing organic residues
• Multiple vapor rinsing cycles for improved process flexibility
• Dual condensation system and dual sealing design to help control solvent volatilization
• Fully closed-loop system with low solvent loss and no wastewater discharge
• Flexible process settings based on different cleaning requirements
• Industrial computer control for stable and convenient operation

• Customized baskets and fixtures available


Why Vapor SUI Mini 3

Vapor SUI Mini 3 is a practical choice for users who need a compact co-solvent vapor phase cleaning machine for precision and water-free cleaning. Its main advantage is that it provides more flexible process capability than single-solvent configurations while maintaining stable cleaning performance and low residue levels.

For applications involving bare chip cleaning, 3D packaging components, SIP, microwave components, and assemblies with low stand-off structures, Vapor SUI Mini 3 provides a compact and stable solution. It is especially suitable for factories where wastewater discharge is not allowed.



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