En
中文 Ru
Products
Equipment solutions for cleaning, lead forming, and microelectronics assembly
Scroll down
Your position : Products Lead Tinning Equipment
Lead Tinning Machine - Hyper Tinning
Profile：

Lead Tinning Machine - Hyper Tinning is designed for high-capacity and high-precision gold removal and tinning of multiple device types. It supports side lead-out packages such as QFP and SOP, as well as bottom pad packages such as QFN. The equipment mainly consists of visual recognition, flux, leveling workbench, gold removal workstation, tinning workstation, high-precision motion mechanism, and control system.


Compared with more flexible tinning solutions, Hyper Tinning is more focused on production efficiency and automated process management. It is suitable for users who need higher throughput together with stable process control for automated lead tinning applications.

Scroll down
Main Functions Equipment Features
Main Functions
  • Gold removal and tinning of QFP devices
  • Gold removal and tinning of SOP devices
  • Gold removal and tinning of QFN devices
  • Tinning of side lead-out packages
  • Tinning of bottom pad packages
  • Rework tinning of solder bridge defective products
  • Automated component tinning for higher-throughput production
Equipment Features
  • Designed for high-capacity gold removal and tinning applications
  • Supports QFP, SOP, and QFN devices with a wide adaptation range
  • High-precision motion mechanism for stable automated operation
  • Visual recognition and compensation technology
  • Computer-managed process flow and parameter control
  • Suitable for automated process management and efficient production
  • Supports stable tinning quality together with higher output capability
  • Practical solution for users who require both precision and higher production efficiency

Why Hyper Tinning


Hyper Tinning is suitable for users who need a higher-capacity lead tinning solution for automated production. Its main advantage is that it combines process precision with stronger production efficiency, making it more suitable for users who handle larger volumes and require stable automated tinning performance. For applications involving QFP, SOP, QFN, and similar devices, Hyper Tinning provides a practical high-output solution for gold removal and tinning processes.



TOP