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Vacuum Heating Plate - VTP200
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VTP200 is a vacuum heating plate designed for eutectic soldering and sintering of microwave devices, microwave components, and TR modules. It is suitable for applications where high process stability, vacuum conditions, and inert gas protection are needed during soldering. The system is mainly composed of a heating system, an inert gas protection circuit, and a vacuum circuit. 

The heating platform uses a resistance heater embedded on the back of the plate and adopts intelligent closed-loop temperature control. Together with the touch-screen human-machine interface, this makes the system suitable for users who need precise temperature management and clear process monitoring in demanding soldering work.  




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Technical Parameter Equipment Features
Technical Parameter


  • Eutectic soldering of microwave devices
  • Eutectic soldering of microwave components
  • Eutectic soldering of TR modules
  • Vacuum-assisted soldering processes
  • Inert-gas-protected heating and soldering applications
  • High-reliability microwave assembly processes


Equipment Features


  • Maximum vacuum: 8×10-2mbar
  • Heated area: 200mm×200mm
  • Clearance above heating plate：50mm
  • Maximum temperature:450℃
  • Control accuracy: +/- 1℃
  • Temperature uniformity：+/- 1.5 % from the set temperature, within 180mm area
  • The resistance heater is embedded in the heating plate, maximum effective power is 3KW, adopts area heating method.
  • Temperature measurement: one temperature sensor inside the machine for system temperature measurement; one temperature probe for operator to do debugging

Why VTP200


VTP200 is suitable for users who need a vacuum heating platform for eutectic soldering rather than a general heating stage. Its main advantage is that it combines vacuum capability, inert gas protection, and precise closed-loop temperature control in one compact system. For microwave devices, components, and TR modules that require more controlled soldering conditions, VTP200 provides a more stable and process-oriented solution.




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