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Split Heating Stage
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The split heating stage is designed for chip and substrate welding in microelectronics packaging and assembly processes. It is mainly used for chip-to-substrate and substrate-to-casing welding in applications such as hybrid circuits and optical fiber devices. It is suitable for conductive adhesive bonding and eutectic welding where temperature stability and handling flexibility are important.


Compared with the integrated version, the split heating stage allows the hot plate to be moved more easily. This makes it more suitable for users who need more flexible positioning during welding or who prefer a separated control and heating arrangement in the workstation.



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Technical Parameter Equipment Features
Technical Parameter
  • Chip-to-substrate welding
  • Substrate-to-casing welding
  • Hybrid circuit packaging
  • Optical fiber device assembly
  • Conductive adhesive bonding
  • Eutectic welding in microelectronics assembly
Equipment Features


  • Split structure with separate hot plate and controller
  • Movable hot plate for easier positioning and operation
  • Aluminum heating plate with oxidized surface for improved anti-oxidation and corrosion resistance
  • Intelligent temperature control technology
  • Closed-loop temperature control
  • High temperature control accuracy
  • Continuously adjustable temperature


Why split heating stage


The split heating stage is suitable for users who need more flexibility in workstation layout and hot plate positioning during microelectronics assembly. Its main advantage is the split structure, which makes the hot plate easier to move while still maintaining stable temperature control and heating uniformity. For users handling precise chip or substrate welding operations, it offers a more flexible heating solution.  



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