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Integrated Heating Stage
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The integrated heating stage is designed for chip and substrate welding in microelectronics packaging and assembly processes. It is mainly used for chip-to-substrate and substrate-to-casing welding in applications such as hybrid circuits and optical fiber devices. It is suitable for conductive adhesive bonding and eutectic welding processes where stable heating and temperature uniformity are important. 


The system consists of a heating plate and a temperature controller in an integrated structure. It is suitable for users who want a compact heating solution with straightforward installation and operation for routine packaging and assembly work.



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Technical Parameter Equipment Features
Technical Parameter
  • Chip-to-substrate welding
  • Substrate-to-casing welding
  • Hybrid circuit packaging
  • Optical fiber device assembly
  • Conductive adhesive bonding
  • Eutectic welding in microelectronics assembly
Equipment Features
  • Integrated heating plate and temperature controller structure
  • Aluminum heating plate with oxidized surface for improved anti-oxidation and corrosion resistance
  • Intelligent temperature control technology
  • Closed-loop temperature control
  • High temperature control accuracy
  • Continuously adjustable temperature

Why integrated heating stage


The integrated heating stage is suitable for users who want a compact and practical heating platform for microelectronics packaging and eutectic welding. Its main advantage is the integrated structure, which makes installation simpler and daily use more direct. For users who need stable temperature control, good uniformity, and a fixed workstation layout, it provides a reliable heating solution.



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