Lead forming is the process of cutting and shaping the leads of electronic components to match assembly, soldering, or packaging requirements. It is commonly used for flat packaged devices, through-hole components, and other parts that require defined lead shape, length, shoulder height, or coplanarity before assembly.

Lead forming helps improve assembly consistency and makes components better suited for subsequent soldering or installation. Depending on the application, it may involve cutting, bending, kinking, shaping, or reconditioning of the leads.