Purbest has achieved a new technological breakthrough in CLCC forming.

CLCC packaging, also known as Ceramic Leaded Chip Carrier, is one of the SMT package types and is also referred to as QFJ or QFJ-G packaging. It is widely used in military equipment, modern communication systems, and electronic instruments, where package reliability and forming quality are especially important.

With more than ten years of professional experience, strong manufacturing capability, and continuous R&D effort, Purbest has built a solid foundation in the field of component forming. In September 2021, we achieved a new breakthrough in CLCC forming technology.

This technology uses a smooth and practical operating process to form unformed CLCC packages into a J-shape. The formed package provides high precision, good consistency, and no indentation damage to the leads.

Purbest component lead forming equipment is designed with a concise structure and reliable performance, making it suitable for high-mix, low-volume production. Our product range can be applied to QFP, SOP, THT, CLCC, and other component types to meet different customer requirements.

Adhering to the goal of developing world-class products, Purbest will continue to innovate and support customers in meeting the challenges of the semiconductor industry.