On July 23, Purbest participated in the CEIA Summit Forum in Nanjing, where we met with many industry experts and well-known companies from China and abroad. Under the challenging situation of the pandemic, this gathering was especially valuable.
As an exhibiting company, Purbest brought its latest products to the event, and there was strong visitor interest at our booth throughout the day.
Among the products presented, Cleaning Machine for Electronic Assembly - Hydro-clean LDS attracted attention for its cleaning capability in electronics manufacturing applications.
We also introduced Super Tinning, a system designed for THT and SMT component tinning and re-tinning applications. The system can automatically handle a wide range of common and special components and connectors, including QFP, flatpack, axial, discrete, BGA, PLCC, CLCC, DIP, SIP, capacitors, resistors, and inductors.
Intelligent manufacturing VS Ancient capital of Six Dynasties
Focus on the latest industry development trend
Promote military electronic innovation
As an exhibition enterprise,Purbest has brought our latest products, and visitors in front of the exhibition stand are in an endless stream.
Review of exhibits
Cleaning machine for electronic assembly Hydro-clean LDS
Automatic Forming
System - APFL
Automatic forming system (APFL), adopting a precision servo-electric press and an adjustable double-sided mold, can form all kinds of flat packages(top lead chip, middle lead chip and bottom lead chip).
Components tinning system
Super Tinning can be configured with up to eight stations, including automatic loading and unloading, visual positioning and detection, fluxing, preheating, THT alloy removal, THT tinning, SMT alloy removal, and SMT tinning. This provides users with a practical and flexible solution for different component tinning requirements.
Through this event, Purbest further strengthened communication with industry professionals and shared more about our equipment and application solutions for electronics manufacturing.
