Purbest is pleased to announce the launch of Vapor SUI, a vapor phase cleaning machine developed for high-reliability electronic assemblies, microelectronics, and components requiring a water-free cleaning process.

With continuous development by our R&D team, Vapor SUI has been designed as a new-generation solvent cleaning system. Compared with traditional ultrasonic vapor cleaning equipment, Vapor SUI adopts Spray Under Immersion (SUI) technology to improve cleaning performance while helping reduce solvent consumption.

The system combines spray under immersion, bubbling, and vertical basket oscillation to achieve effective cleaning without relying on ultrasonic cleaning. For applications requiring additional cleaning energy, ultrasonic cleaning can also be provided as an optional configuration.

Cleaning Applications

Vapor SUI is suitable for a wide range of microelectronics and electronic assembly cleaning applications, including:

• Cleaning after die bonding
• Cleaning of 3D packaging
• Cleaning of micro-standoff components
• SiP and microwave assembly cleaning
• Cleaning before chip packaging
• Cleaning before PCBA coating
• Cleaning of low-standoff electronic assemblies, such as FC, BGA, CSP, BTC, QFN, and MELF
• Applications requiring a water-free cleaning process
• Factories where wastewater discharge is restricted or not permitted

Key Advantages

Spray Under Immersion Technology
Vapor SUI uses Purbest’s SUI cleaning technology, with high-flow spray under immersion to enhance solvent circulation and improve cleaning coverage in complex structures.

Effective Cleaning Without Ultrasonic Energy
The combination of spray under immersion, bubbling, and vertical basket oscillation helps remove residues effectively, even without ultrasonic cleaning. Ultrasonic cleaning can be configured as an option when required.

Water-Free Cleaning Process
The solvent-based cleaning process is suitable for applications where water cleaning is not allowed or not preferred, such as cleaning after die bonding and other sensitive microelectronics processes.

Multiple Vapor Rinse Cycles
Multiple vapor rinse cycles provide greater process flexibility and help improve the final cleanliness of components and assemblies.

Solvent Loss Control
The system is designed with refrigeration and sealing technologies to help reduce solvent evaporation and support safer, more environmentally responsible operation.

Flexible Process Settings
Cleaning parameters can be adjusted according to different applications, component structures, and cleanliness requirements.

Customized Baskets and Fixtures
A wide range of customized baskets and fixtures can be provided to match different product sizes, loading methods, and cleaning requirements.