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Your position : Products Lead Forming Equipment Automatic Lead Forming Equipment
Automatic Bottom Lead Forming Machine APFL/BOTTOM
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APFL Bottom is an automatic bottom lead forming system designed for flat packaged devices that require bottom lead forming, while also supporting middle lead and top lead packages. It adopts a precision servo-electric press and an adjustable double-side mold to complete lead forming and cutting in one cycle. The machine is controlled by PC and can automatically complete the full forming process after the chip is placed in position. It is suitable for high-mix and low-volume production where both flexibility and forming accuracy are important.  


The system supports different chip sizes, lead lengths, and forming heights according to customer requirements. With automatic adjustment, pressure feedback, and programmable forming control, it is suitable for users who need a more automated solution for bottom lead package forming and related flat-package applications.  



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Main Functions Equipment Features
Main Functions
  • Automatic adjustment of mold position
  • Precision pressure control
  • Multi-segment pressurization program
  • Precise Z-axis displacement control
  • High precision pressure feedback
  • Process parameters storage and calling
  • Statistical analysis of processing data
Equipment Features


  • Flexible universal holder applies to different sizes of chips. All kinds of two-side or four-side packages can be formed into gull-winged shape.
  • The standoff height (A+J) can be set via computer and automatically adjusted.
  • The gold-plated surface of the leads will be slightly scratched after forming, but not damaged. There will be no indentation, crack or pit on the leads.
  •  Positioning accuracy of electric-servo press is 0.01mm.
  •  Mechanical arm for automatic pick-and-place. Movement precision is 0.02mm.
  •  Cutting length：0.8mm，1（customizable）
  •  Body to bend dimension：0.5mm，0.75mm，1.0mm (customizable）



Why APFL Bottom


APFL Bottom is suitable for users who need an automated forming system for bottom lead packages, but also want the flexibility to handle middle lead and top lead devices on the same platform. Its main advantage is the combination of servo-electric forming, automatic pick-and-place, and software-based parameter control, which makes it suitable for production where accuracy, repeatability, and process traceability are important. For customers handling multiple flat-package types with demanding forming requirements, APFL provides a more automated and more controlled forming solution.








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