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Equipment solutions for cleaning, lead forming, and microelectronics assembly
Automatic Lead Forming System - APFL
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APFL is an automatic lead forming system designed for flat packaged devices. It adopts a precision servo electric forming press and an adjustable double-side mold to form all leads of flat packaged chips, including top exit, middle exit, and bottom exit types. Lead forming and cutting are completed in one cycle, and the machine can process different body sizes, lead lengths, and forming heights according to production needs.  

The equipment is controlled by PC. After the component is loaded, the system can automatically complete forming and cutting. It is suitable for customers who handle many product types with small and medium production volumes and need both flexibility and forming accuracy in one platform. 


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Main Functions
  •    Automatic adjustment of molding mold size
  •    Precision pressure control
  •    Multi stage pressurization control
  •    Accurate Z-axis displacement control
  •    High precision pressure detection feedback
  •    Storage and call of process parameters
  •    Statistical analysis of processing data


Equipment Features
  • Flexible universal mold applies to different sizes of chips. All kinds of two-side or four-side packages can be formed into gull-winged shape.
  • The standoff height can be set via computer and automatically adjusted.
  • The gold-plated surface of the leads will be slightly scratched after forming, but not damaged. There will be no indentation, crack or pit on the leads.
  •  Positioning accuracy of electric-servo press is 0.01mm.
  •  Mechanical arm for automatic pick-and-place. Movement precision is 0.02mm.
  •  Lead cutting length:0.8mm,1mm or other size(customizable)
  •  Shoulder width:0.5mm,0.75mm,1.0mm (customizable)
  • Precision servo electric forming press
  • High-precision pressure sensor with real-time pressure feedback


Why APFL


APFL is suitable for users who need a higher level of automation than semi-automatic lead forming systems, but still require flexibility for different package sizes and product types. Its main advantage is the combination of servo electric lead forming, automatic pick-and-place, and software-based parameter control. This makes it especially useful for customers handling high-mix production where accuracy, repeatability, and data traceability are all important. Features such as pressure-curve recording, parameter libraries, and automatic adjustment also make process setup faster and more consistent when switching between products.  










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