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Manual Wedge Bonder M60W
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M60W is mainly used for wedge bonding of hybrid circuits, MCM multichip modules, optical devices, microwave devices, laser devices, and discrete devices. It is equipped with a height-adjustable workbench, suitable for various types of wire bonding such as aluminum wire, gold wire, and gold ribbon. It can export bonding programs to flash disks for storage, with ample storage space.





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Equipmeng features
Equipmeng features

  • WINDOWS system, easy to operate
  • Optional adaptive microscope system
  • Deep access bonding capability
  • X, Y, Z operating lever, flexible operation, convenient for bonding at different heights
  • Compatible with wire diameters: Gold wire: 17-75 μm, Aluminum wire: 20-76 μm, Gold ribbon: Up to 25×250 μm

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