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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Component Tinning Equipment
Your position : Product Center Cleaning Equipment For Electronic Assembly SMT Cleaning
PCBA cleaning machine Hydro-clean LDS
Profile：
Remove various flux residues, clean small mechanical components, remove contamination from PCB production, and remove FOD. Clean high-density electronic components with low stand-off components, such as BGA, CSP.BTC, QFN, and MELF. Clean power devices and sensitive electronic devices, clean misprints with complex components, and clean before coating and bonding.
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Cleaning applications Equipment features
Cleaning applications
  • Remove various flux residues
  • Cleaning small mechanical components
  • Cleaning contaminants in PCB production, remove FOD
  • Clean high-density electronic components with low stand-off components, such as BGA, CSP, BTC, QFN, MELF
  • Cleaning power devices
  • Cleaning sensitive electronic devices
  • Cleaning misprints with complex components
  • Cleaning before coating and bonding


Equipment features
  • Fully closed-loop system, zero discharge
  • Triple cleaning capacity
  • Linear direct spray technology can achieve consistent cleaning results
  • 100% filtration of DI water
  • Second rinse is optional
  • Hot air knife drying
  • Visual window for process control
  • All process steps can be refined into up to 5 sub steps, achieving extremely high flexibility
  • Multiple types of standard and customized PCBA fixtures
  • Various stencil fixtures
  • 3 completely independent liquid pipelines
  • Low consumption of cleaning agents and DI water
  • All process is equipped with liquid level sensors



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