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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Parylene Coating System Heating Plate Series Component Tinning Equipment Other Equipment
Your position : Product Center Cleaning Equipment For Electronic Assembly SMT Cleaning
Extra-large PCBA Cleaning Machine Hydro-clean MAX
Profile：
  • Maximum size of PCBA that can be cleaned(1500×700MM)
  • Clean high-density electronic components with low-gap devices, such as FC,BGA,CSP,BTC,QFN,MELF
  • Remove various types of flux residues
  • Clean small mechanical parts and power devices
  • Remove contaminants in PCB production and eliminate FOD
  • Can clean sensitive electronic devices
  • Single-sided misprinted boards on complex components
  • Cleaning before coating and bonding
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Cleaning applications Equipment features
Cleaning applications
  • Maximum size of PCBA that can be cleaned(1500×700MM)
  • Clean high-density electronic components with low-gap devices, such as FC,BGA,CSP,BTC,QFN,MELF
  • Remove various types of flux residues
  • Clean small mechanical parts and power devices
  • Remove contaminants in PCB production and eliminate FOD
  • Can clean sensitive electronic devices
  • Single-sided misprinted boards with complex components
  • Cleaning before coating and bonding
Equipment features
  • Fully automatic closed-loop zero-discharge spray in air system
  • Capable of cleaning extra-large PCBA(Maximum size 1500×700MM)
  • Linear direct spray technology for consistent cleaning results
  • 100% filtration of all DI water
  • Precision rinsing optional
  • Hot air knife drying
  • Large process control viewing window
  • Multiple standard and custom PCBA fixtures
  • Fixtures suitable for various steel meshes
  • Three completely independent liquid pipelines
  • Low consumption of cleaning agent and DI water
  • All process stages are equipped with liquid level sensors
  • Excellent water utilization rate
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