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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Component Tinning Equipment
Your position : Product Center Cleaning Equipment For Electronic Assembly Micro Assembly Cleaning
Vapor degreasing system-Vapor SUI mini
Profile：
Micro gap ultra precision flux cleaning; Cleaning of microwave components/micro assembly modules; Cleaning before semiconductor packaging; Clean the components after lead tinning; Suitable for components that require water free cleaning; Factory that does not allow wastewater discharge.
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Cleaning applications Equipment features
Cleaning applications
  • Micro gap ultra precision flux cleaning
  • Cleaning of microwave components/micro assembly modules
  • Cleaning before semiconductor packaging
  • Cleaning of components after lead tinning
  • Suitable for components that require water free cleaning
  • Factory that does not allow wastewater discharge


Equipment features
  • Suitable for solvent cleaning - (NPB), etc;
  • Water free cleaning, cleaner is automatically recycled
  • Built in filter to remove impurities, solvent recycling, and reduce costs
  • Single layer refrigeration+120% free zone setting to reduce solvent loss VS2208
  • Multiple cycles of vapor phase rinsing to improve process flexibility
  • Unique condensation system+sealing system, strictly controlling solvent evaporation, and user-friendly human-machine environment
  • The cleaning process can be flexibly set according to the cleaning needs
  • Industrial computer control
  • Customizable baskets and fixtures


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