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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Component Tinning Equipment
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Cleaning machine Hydro-clean LDS-Plus
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Used for cleaning PCB after soldering, PCBA before coating,  power devices and micro mechanical components. A special filtering system with high flow, which can be set as closed-loop or open-loop in the software, and the first rinse and second rinse system are completely independent.
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Cleaning applications Equipment features
Cleaning applications
  • Remove various types of flux residues
  •  Cleaning small mechanical components
  •  Contaminants in PCB production, remove FOD
  •  Clean high-density electronic components with low stand-off components, such as FC, BGA, CSP, BTC, QFN, MELF
  •  Cleaning power devices
  •  Cleanable sensitive electronic devices
  •  Misprinting Board with Complex Components 
  •  Cleaning before coating and bonding


Equipment features
  •   Fully closed-loop spray in air system
  •   Linear direct spray technology can achieve consistent cleaning results
  •   100% filtration of DI water
  •   Second rinse is optional
  •   Hot air knife drying
  •   Large process control visual window
  •   Multiple standard and customized PCBA fixtures
  •   Various stencil fixtures
  •   Completely independent liquid pipelines
  •   Low consumption of cleaning agents and DI water
  •   All process is with liquid level sensors
  •   Excellent water utilization rate



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