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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Component Tinning Equipment
Your position : Product Center Lead Forming Equipment Lead Cutting System
PCL
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Applicable to SOP or QFP component lead cutting before forming
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major function Equipment features
major function
Suitable for forming SOP or QFP devices
Equipment features
  • Dimension (L*W*H):590mm*570mm*950mm
  • Weight : 150KG
  • Component body size : 5*5mm-50*50mm
  • Lead thickness : 0.10mm-0.30mm
  • Lead length : 0.8mm-5mm
  • Shear burr : ≤0.05mm
  • lead repeat accuracy : ±0.01mm
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