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Cleaning Equipment For Electronic Assembly Lead Forming Equipment Wire Bonder Component Tinning Equipment
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Super tinning machine
Profile：
Super Tinning is for THT and SMT component tinning and re-tinning applications. The system can automatically handle common and exotic components and connectors, including， but not limited to：QFP，flatpack, axial, discrete, BGA，PLCC，CLCC，DIP，SIP，capacitors, resistor and inductor components. The system can be configured with up to 8 possible stations: automatic loading and unloading station, visual positioning and detection station, flux station, preheat station, THT alloy removal station, THT tinning station, SMT alloy removal station and SMT tinning station.
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major function Equipment features
major function
  • X/Y/Z motion, and 360° rotation for superior solder performance.
  • Automatically complete the whole process
  • Precisely control of immersion depth and tinning time.
  • Automatic data record for quality tracing.
  • Data management and communication interface.
Equipment features
  • High Precision Screw Rod Motion / Repeatability +/-0.05mm.
  • X, Y, Z and Rotation motion, superior repeatability.
  • Automatic loading and unloading of SMT components.
  • Automatic center positioning and outline identification
  • Wide Process Control: solder temp, immersion depth, travel speed, dwell time, simultaneous moves
  • Agitation motion for effective alloy removal
  • Automated rotation for QFP
  • Automatic result detection
  • Nitrogen protection
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